Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff +2 more | 2020-07-14 |