Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Charles L. Arvin +5 more | 2020-03-03 |
| 10553516 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |
| 10553522 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |