Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10702866 | Layered silicon and stacking of microfluidic chips | Joshua T. Smith, Benjamin H. Wunsch | 2020-07-07 |
| 10679887 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-06-09 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-03-10 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker | 2020-02-25 |