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Home › Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

US Patent 10586726 · Granted Mar 10, 2020

Estimated economic value: $1,254,000 ⓘ

Assignee

IBM

Inventors

Paul S. Andry (128 patents)
Bing Dang (140 patents)
Jeffrey D. Gelorme (112 patents)
Li-Wen Hung (65 patents)
John U. Knickerbocker (308 patents)
Cornelia Tsang Yang (17 patents)

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