Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832945 | Techniques to improve critical dimension width and depth uniformity between features with different layout densities | Nicole Saulnier, Indira Seshadri, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Gauri Karve +3 more | 2020-11-10 |
| 10784197 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger | 2020-09-22 |
| 10770347 | Interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2020-09-08 |
| 10763160 | Semiconductor device with selective insulator for improved capacitance | Christopher J. Penny, Benjamin D. Briggs, Michael Rizzolo, Lawrence A. Clevenger, Huai Huang | 2020-09-01 |
| 10692755 | Selective deposition of dielectrics on ultra-low k dielectrics | Rudy J. Wojtecki, Noel Arellano, Ekmini Anuja De Silva | 2020-06-23 |
| 10679892 | Multi-buried ULK field in BEOL structure | Yann Mignot, Chih-Chao Yang | 2020-06-09 |
| 10679934 | Capacitance reduction in sea of lines BEOL metallization | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2020-06-09 |
| 10651078 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo | 2020-05-12 |
| 10643890 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami +2 more | 2020-05-05 |
| 10629478 | Dual-damascene formation with dielectric spacer and thin liner | Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2020-04-21 |
| 10622250 | Dielectric gap fill evaluation for integrated circuits | Isabel Cristina Chu, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Ekmini Anuja De Silva, Gauri Karve +3 more | 2020-04-14 |
| 10593591 | Interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2020-03-17 |
| 10529622 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, Koichi Motoyama, James J. Kelly, Chih-Chao Yang | 2020-01-07 |
| 10529662 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger | 2020-01-07 |