Issued Patents 2020
Showing 25 most recent of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879190 | Patterning integration scheme with trench alignment marks | Hao Tang, Dominik Metzler, Cornelius Brown Peethala | 2020-12-29 |
| 10847475 | Advanced crack stop structure | Baozhen Li, Xiao Hu Liu, Griselda Bonilla | 2020-11-24 |
| 10847458 | BEOL electrical fuse and method of forming the same | Baozhen Li | 2020-11-24 |
| 10840195 | Advanced crack stop structure | Baozhen Li, Xiao Hu Liu, Griselda Bonilla | 2020-11-17 |
| 10840447 | Fabrication of phase change memory cell in integrated circuit | Baozhen Li, Andrew Tae Kim, Barry P. Linder | 2020-11-17 |
| 10840194 | Advanced crack stop structure | Baozhen Li, Xiao Hu Liu, Griselda Bonilla | 2020-11-17 |
| 10840325 | Low resistance metal-insulator-metal capacitor electrode | Joseph F. Maniscalco, Koichi Motoyama, Oscar van der Straten | 2020-11-17 |
| 10833266 | Resistive memory crossbar array with ruthenium protection layer | Takashi Ando, Lawrence A. Clevenger, Michael Rizzolo | 2020-11-10 |
| 10833257 | Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts | Ashim Dutta, John C. Arnold, Theodorus E. Standaert | 2020-11-10 |
| 10833127 | Three-dimensional and planar memory device co-integration | Takashi Ando, Michael Rizzolo, Lawrence A. Clevenger | 2020-11-10 |
| 10832963 | Forming gate contact over active free of metal recess | Kangguo Cheng | 2020-11-10 |
| 10833258 | MRAM device formation with in-situ encapsulation | Ashim Dutta, Daniel C. Edelstein, Karthik Yogendra, John C. Arnold | 2020-11-10 |
| 10833007 | Circular ring shape fuse device | — | 2020-11-10 |
| 10825792 | Metal bonding pads for packaging applications | — | 2020-11-03 |
| 10818548 | Method and structure for cost effective enhanced self-aligned contacts | Kafai Lai, Yongan Xu, Su Chen Fan | 2020-10-27 |
| 10818589 | Metal interconnect structures with self-forming sidewall barrier layer | Hari Prasad Amanapu, Cornelius Brown Peethala, Raghuveer Patiolla | 2020-10-27 |
| 10811599 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Liying Jiang, Sebastian Naczas, Michael Rizzolo | 2020-10-20 |
| 10811353 | Sub-ground rule e-Fuse structure | Baozhen Li, Andrew Tae Kim, Ernest Y. Wu | 2020-10-20 |
| 10804147 | Semiconductor device with reduced via resistance | Conal E. Murray | 2020-10-13 |
| 10796911 | Hardmask stress, grain, and structure engineering for advanced memory applications | Michael Rizzolo, Ashim Dutta, Oscar van der Straten | 2020-10-06 |
| 10790445 | Protuberant contacts for resistive switching devices | Takashi Ando, Lawrence A. Clevenger | 2020-09-29 |
| 10784159 | Semiconductor device and method of forming the semiconductor device | Lawrence A. Clevenger, Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang | 2020-09-22 |
| 10777735 | Contact via structures | Daniel C. Edelstein, Bruce B. Doris, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack | 2020-09-15 |
| 10770395 | Silicon carbide and silicon nitride interconnects | — | 2020-09-08 |
| 10770393 | BEOL thin film resistor | Andrew Tae Kim, Baozhen Li, Ernest Y. Wu | 2020-09-08 |