Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804147 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2020-10-13 |
| 10714379 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2020-07-14 |
| 10600686 | Controlling grain boundaries in high aspect-ratio conductive regions | Chih-Chao Yang | 2020-03-24 |
| 10553483 | Semiconductor device with reduced via resistance | Chih-Chao Yang | 2020-02-04 |