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MRAM device formation with in-situ encapsulation |
Ashim Dutta, Chih-Chao Yang, Karthik Yogendra, John C. Arnold |
2020-11-10 |
| 10777735 |
Contact via structures |
Chih-Chao Yang, Bruce B. Doris, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack |
2020-09-15 |
| 10770347 |
Interconnect structure |
Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha |
2020-09-08 |
| 10714683 |
Multilayer hardmask for high performance MRAM devices |
Michael Rizzolo, Theodorus E. Standaert, Kisup Chung, Isabel Cristina Chu, John C. Arnold |
2020-07-14 |
| 10686124 |
Contact via structures |
Chih-Chao Yang, Bruce B. Doris, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack |
2020-06-16 |
| 10680169 |
Multilayer hardmask for high performance MRAM devices |
Michael Rizzolo, Theodorus E. Standaert, Kisup Chung, Isabel Cristina Chu, John C. Arnold |
2020-06-09 |
| 10643890 |
Ultrathin multilayer metal alloy liner for nano Cu interconnects |
Alfred Grill, Seth L. Knupp, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more |
2020-05-05 |
| 10615074 |
Advanced copper interconnects with hybrid microstructure |
Chih-Chao Yang |
2020-04-07 |
| 10607933 |
Interconnect structures with fully aligned vias |
Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath |
2020-03-31 |
| 10593591 |
Interconnect structure |
Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha |
2020-03-17 |
| 10586921 |
Forming self-aligned contacts on pillar structures |
Anthony J. Annunziata, Eugene J. O'Sullivan, Henry K. Utomo |
2020-03-10 |
| 10586920 |
Forming self-aligned contacts on pillar structures |
Anthony J. Annunziata, Eugene J. O'Sullivan, Henry K. Utomo |
2020-03-10 |
| 10559751 |
Bottom electrode for semiconductor memory device |
Chih-Chao Yang, Theodorus E. Standaert |
2020-02-11 |
