Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804193 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Raghuveer R. Patlolla | 2020-10-13 |
| 10770347 | Interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2020-09-08 |
| 10763166 | Self-forming barrier for use in air gap formation | Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny | 2020-09-01 |
| 10685879 | Lithographic alignment of a conductive line to a via | John C. Arnold, Ashim Dutta, Dominik Metzler | 2020-06-16 |
| 10668562 | Laser machining apparatus | — | 2020-06-02 |
| 10643890 | Ultrathin multilayer metal alloy liner for nano Cu interconnects | Daniel C. Edelstein, Alfred Grill, Seth L. Knupp, Son V. Nguyen, Vamsi K. Paruchuri +2 more | 2020-05-05 |
| 10593591 | Interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2020-03-17 |
| 10580740 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Deepika Priyadarshini, Michael Rizzolo | 2020-03-03 |
| 10576583 | Laser machining device | Masanobu Hatada, Takayoshi Matsumoto | 2020-03-03 |
| 10529663 | Copper interconnect with filled void | Chih-Chao Yang | 2020-01-07 |