Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833122 | Bottom electrode and dielectric structure for MRAM applications | Hari Prasad Amanapu, Cornelius Brown Peethala, Michael Rizzolo | 2020-11-10 |
| 10832917 | Low oxygen cleaning for CMP equipment | Donald F. Canaperi, Pavan S. Chinthamanipeta, Cornelius Brown Peethala | 2020-11-10 |
| 10804193 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Takeshi Nogami | 2020-10-13 |
| 10741748 | Back end of line metallization structures | Joseph F. Maniscalco, Cornelius Brown Peethala, Chih-Chao Yang | 2020-08-11 |
| 10714382 | Controlling performance and reliability of conductive regions in a metallization network | Cornelius Brown Peethala, Chih-Chao Yang | 2020-07-14 |
| 10699945 | Back end of line integration for interconnects | Cornelius Brown Peethala, Chih-Chao Yang, Roger A. Quon | 2020-06-30 |
| 10686126 | Back end of line metallization structures | Joseph F. Maniscalco, Cornelius Brown Peethala, Chih-Chao Yang | 2020-06-16 |
| 10685876 | Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability | Su Chen Fan, Hemanth Jagannathan, Cornelius Brown Peethala | 2020-06-16 |
| 10672707 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Chih-Chao Yang | 2020-06-02 |
| 10559530 | Forming dual metallization interconnect structures in single metallization level | Hari Prasad Amanapu, Charan V. Surisetty | 2020-02-11 |