Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840325 | Low resistance metal-insulator-metal capacitor electrode | Koichi Motoyama, Oscar van der Straten, Chih-Chao Yang | 2020-11-17 |
| 10741748 | Back end of line metallization structures | Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2020-08-11 |
| 10686126 | Back end of line metallization structures | Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2020-06-16 |
| 10546815 | Low resistance interconnect structure with partial seed enhancement liner | Oscar van der Straten, Koichi Motoyama, Alexander Reznicek | 2020-01-28 |
| 10529622 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Koichi Motoyama, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2020-01-07 |