Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832973 | Stress modulation of nFET and pFET fin structures | Huimei Zhou, Kangguo Cheng, Michael P. Belyansky, Oleg Gluschenkov, Richard A. Conti +1 more | 2020-11-10 |
| 10825726 | Metal spacer self aligned multi-patterning integration | Hsueh-Chung Chen, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-11-03 |
| 10811310 | Metal spacer self aligned double patterning with airgap integration | Hsueh-Chung Chen, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-10-20 |
| 10714389 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-07-14 |
| 10665512 | Stress modulation of nFET and pFET fin structures | Huimei Zhou, Kangguo Cheng, Michael P. Belyansky, Oleg Gluschenkov, Richard A. Conti +1 more | 2020-05-26 |
| 10651125 | Replacement metal cap by an exchange reaction | Cornelius Brown Peethala | 2020-05-12 |
| 10615027 | Stack viabar structures | Su Chen Fan, Hsueh-Chung Chen, Yann Mignot, Terence B. Hook | 2020-04-07 |
| 10529622 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, Koichi Motoyama, Hosadurga Shobha, Chih-Chao Yang | 2020-01-07 |