Issued Patents 2020
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879068 | Extreme ultraviolet lithography for high volume manufacture of a semiconductor device | Yongan Xu, John C. Arnold, Oleg Gluschenkov | 2020-12-29 |
| 10832955 | Methods and structures for forming uniform fins when using hardmask patterns | Peng Xu, Kangguo Cheng, Choonghyun Lee | 2020-11-10 |
| 10825726 | Metal spacer self aligned multi-patterning integration | Hsueh-Chung Chen, James J. Kelly, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-11-03 |
| 10825720 | Single trench damascene interconnect using TiN HMO | Yongan Xu, Muthumanickam Sankarapandian | 2020-11-03 |
| 10811310 | Metal spacer self aligned double patterning with airgap integration | Hsueh-Chung Chen, James J. Kelly, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-10-20 |
| 10755963 | Crossbar reinforced semiconductor fins having reduced wiggling | Kangguo Cheng, Chi-Chun Liu, Muthumanickam Sankarapandian | 2020-08-25 |
| 10755928 | Fabricating electrically nonconductive blocks using a polymer brush and a sequential infiltration synthesis process | Chi-Chun Liu, Kristin Schmidt, Martha I. Sanchez, Daniel P. Sanders, Nelson Felix +1 more | 2020-08-25 |
| 10748823 | Embedded etch rate reference layer for enhanced etch time precision | Alan C. Thomas, Daniel P. Sanders, Dario L. Goldfarb, Nelson Felix, Chi-Chun Liu +1 more | 2020-08-18 |
| 10741452 | Controlling fin hardmask cut profile using a sacrificial epitaxial structure | Eric R. Miller, Stuart A. Sieg, Indira Seshadri, Christopher J. Waskiewicz | 2020-08-11 |
| 10692776 | Formation of VTFET fin and vertical fin profile | Eric R. Miller, Marc A. Bergendahl, Kangguo Cheng | 2020-06-23 |
| 10679892 | Multi-buried ULK field in BEOL structure | Chih-Chao Yang, Hosadurga Shobha | 2020-06-09 |
| 10672705 | Method of forming a straight via profile with precise critical dimension control | Yongan Xu, Junli Wang, Joe Lee | 2020-06-02 |
| 10658180 | EUV pattern transfer with ion implantation and reduced impact of resist residue | Yongan Xu, Oleg Gluschenkov | 2020-05-19 |
| 10658190 | Extreme ultraviolet lithography patterning with directional deposition | Yongan Xu, Ekmini Anuja De Silva, Su Chen Fan | 2020-05-19 |
| 10629436 | Spacer image transfer with double mandrel | Yongan Xu | 2020-04-21 |
| 10622301 | Method of forming a straight via profile with precise critical dimension control | Yongan Xu, Junli Wang, Joe Lee | 2020-04-14 |
| 10615027 | Stack viabar structures | Su Chen Fan, Hsueh-Chung Chen, James J. Kelly, Terence B. Hook | 2020-04-07 |
| 10607922 | Controlling via critical dimension during fabrication of a semiconductor wafer | Muthumanickam Sankarapandian, Yongan Xu | 2020-03-31 |
| 10586732 | Via cleaning to reduce resistance | Chih-Chao Yang | 2020-03-10 |
| 10573520 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Yongan Xu, Lawrence A. Clevenger, Cornelius Brown Peethala | 2020-02-25 |
| 10559467 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yongan Xu | 2020-02-11 |
| 10546743 | Advanced interconnect with air gap | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Yiheng Xu +2 more | 2020-01-28 |
| 10535567 | Methods and structures for forming uniform fins when using hardmask patterns | Peng Xu, Kangguo Cheng, Choonghyun Lee | 2020-01-14 |