Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832952 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2020-11-10 |
| 10672705 | Method of forming a straight via profile with precise critical dimension control | Yongan Xu, Junli Wang, Yann Mignot | 2020-06-02 |
| 10643859 | Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication | Robert L. Bruce, Eric A. Joseph, Takefumi Suzuki | 2020-05-05 |
| 10636706 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2020-04-28 |
| 10622301 | Method of forming a straight via profile with precise critical dimension control | Yongan Xu, Junli Wang, Yann Mignot | 2020-04-14 |