Issued Patents 2020
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832952 | Selective recessing to form a fully aligned via | Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert | 2020-11-10 |
| 10830841 | Magnetic tunnel junction performance monitoring based on magnetic field coupling | Nicholas Anthony Lanzillo, Michael Rizzolo, Lawrence A. Clevenger, Theodorus E. Standaert, James H. Stathis | 2020-11-10 |
| 10812417 | Auto-incorrect in chatbot human-machine interfaces | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christoper J. Penny, Michael Rizzolo, Aldis Sipolins | 2020-10-20 |
| 10804193 | Semiconductor interconnect structure with double conductors | Takeshi Nogami, Raghuveer R. Patlolla | 2020-10-13 |
| 10796833 | Magnetic tunnel junction with low series resistance | Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, Lawrence A. Clevenger, James H. Stathis | 2020-10-06 |
| 10784156 | Self-aligned airgaps with conductive lines and vias | Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2020-09-22 |
| 10785590 | Binaural audio calibration | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2020-09-22 |
| 10784197 | Method and structure to construct cylindrical interconnects to reduce resistance | Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2020-09-22 |
| 10777411 | Semiconductor device with selective dielectric deposition | Son V. Nguyen, Huai Huang | 2020-09-15 |
| 10770348 | Location-specific laser annealing to improve interconnect microstructure | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo | 2020-09-08 |
| 10763166 | Self-forming barrier for use in air gap formation | Elbert E. Huang, Takeshi Nogami, Christopher J. Penny | 2020-09-01 |
| 10763160 | Semiconductor device with selective insulator for improved capacitance | Christopher J. Penny, Michael Rizzolo, Lawrence A. Clevenger, Huai Huang, Hosadurga Shobha | 2020-09-01 |
| 10752039 | Structure of implementing a directed self-assembled security pattern | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo | 2020-08-25 |
| 10746782 | Accelerated wafer testing using non-destructive and localized stress | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis | 2020-08-18 |
| 10747850 | Medication scheduling and alerts | Maryam Ashoori, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha +1 more | 2020-08-18 |
| 10739397 | Accelerated wafer testing using non-destructive and localized stress | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis | 2020-08-11 |
| 10741751 | Fully aligned semiconductor device with a skip-level via | Nicholas Anthony Lanzillo, Chih-Chao Yang, Hsueh-Chung Chen, Lawrence A. Clevenger | 2020-08-11 |
| 10734277 | Top via back end of the line interconnect integration | Chih-Chao Yang, Lawrence A. Clevenger, Brent A. Anderson | 2020-08-04 |
| 10727124 | Structure and method for forming fully-aligned trench with an up-via integration scheme | Lawrence A. Clevenger, Nicholas Anthony Lanzillo | 2020-07-28 |
| 10720567 | Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield | Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2020-07-21 |
| 10679934 | Capacitance reduction in sea of lines BEOL metallization | Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2020-06-09 |
| 10676216 | Non-intrusive unmanned entity inspection | Yuk L. Chan, Eileen P. Tedesco, Kyle E. Gilbertson, Daniel F. Hogerty, Lawrence A. Clevenger | 2020-06-09 |
| 10672707 | Low aspect ratio interconnect | Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Chih-Chao Yang | 2020-06-02 |
| 10658585 | Dedicated contacts for controlled electroforming of memory cells in resistive random-access memory array | Takashi Ando, Lawrence A. Clevenger, Chih-Chao Yang | 2020-05-19 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-05-19 |