Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741609 | Pre-patterned etch stop for interconnect trench formation overlying embedded MRAM structures | Michael Rizzolo, Oscar van der Straten, Chih-Chao Yang | 2020-08-11 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-05-19 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui +2 more | 2020-03-10 |