Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840325 | Low resistance metal-insulator-metal capacitor electrode | Joseph F. Maniscalco, Oscar van der Straten, Chih-Chao Yang | 2020-11-17 |
| 10748812 | Air-gap containing metal interconnects | Kenneth Chun Kuen Cheng, Kisik Choi, Chih-Chao Yang | 2020-08-18 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-05-19 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Gen Tsutsui, Ruqiang Bao +2 more | 2020-03-10 |
| 10546815 | Low resistance interconnect structure with partial seed enhancement liner | Oscar van der Straten, Joseph F. Maniscalco, Alexander Reznicek | 2020-01-28 |
| 10529622 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2020-01-07 |