Issued Patents 2020
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651078 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2020-05-12 |
| 10636706 | Selective recessing to form a fully aligned via | Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert | 2020-04-28 |
| 10629478 | Dual-damascene formation with dielectric spacer and thin liner | Lawrence A. Clevenger, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2020-04-21 |
| 10629529 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2020-04-21 |
| 10629009 | Non-intrusive unmanned entity inspection | Yuk L. Chan, Eileen P. Tedesco, Kyle E. Gilbertson, Daniel F. Hogerty, Lawrence A. Clevenger | 2020-04-21 |
| 10615119 | Back end of line electrical fuse structure and method of fabrication | Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang | 2020-04-07 |
| 10606231 | Computer-mediated reality including physical damping feedback | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2020-03-31 |
| 10593506 | Fold over emitter and collector field emission transistor | Lawrence A. Clevenger, Michael Rizzolo | 2020-03-17 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui, Ruqiang Bao +2 more | 2020-03-10 |
| 10580435 | Sentiment analysis of mental health disorder symptoms | Maryam Ashoori, Lawrence A. Clevenger, Leigh Anne H. Clevenger | 2020-03-03 |
| 10580740 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2020-03-03 |
| 10559498 | Location-specific laser annealing to improve interconnect microstructure | Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo | 2020-02-11 |
| 10553789 | Fully aligned semiconductor device with a skip-level via | Nicholas Anthony Lanzillo, Chih-Chao Yang, Hsueh-Chung Chen, Lawrence A. Clevenger | 2020-02-04 |
| 10545806 | Proximity correction in three-dimensional manufacturing | Lawrence A. Clevenger, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2020-01-28 |
| 10541206 | Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer | Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo | 2020-01-21 |
| 10529662 | Method and structure to construct cylindrical interconnects to reduce resistance | Michael Rizzolo, Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha | 2020-01-07 |