Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770347 | Interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2020-09-08 |
| 10593591 | Interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2020-03-17 |
| 10580740 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Michael Rizzolo | 2020-03-03 |