Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784197 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Lawrence A. Clevenger, Hosadurga Shobha | 2020-09-22 |
| 10784156 | Self-aligned airgaps with conductive lines and vias | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2020-09-22 |
| 10777411 | Semiconductor device with selective dielectric deposition | Son V. Nguyen, Benjamin D. Briggs | 2020-09-15 |
| 10763160 | Semiconductor device with selective insulator for improved capacitance | Christopher J. Penny, Benjamin D. Briggs, Michael Rizzolo, Lawrence A. Clevenger, Hosadurga Shobha | 2020-09-01 |
| 10679934 | Capacitance reduction in sea of lines BEOL metallization | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2020-06-09 |
| 10651078 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2020-05-12 |
| 10629529 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2020-04-21 |
| 10629478 | Dual-damascene formation with dielectric spacer and thin liner | Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2020-04-21 |
| 10529662 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Lawrence A. Clevenger, Hosadurga Shobha | 2020-01-07 |