| 10833149 |
Capacitors |
Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert, Junli Wang |
2020-11-10 |
| 10784156 |
Self-aligned airgaps with conductive lines and vias |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2020-09-22 |
| 10785590 |
Binaural audio calibration |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins |
2020-09-22 |
| 10784197 |
Method and structure to construct cylindrical interconnects to reduce resistance |
Benjamin D. Briggs, Michael Rizzolo, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha |
2020-09-22 |
| 10770653 |
Selective dielectric deposition to prevent gouging in MRAM |
Marc A. Bergendahl, Michael Rizzolo, Christopher J. Waskiewicz |
2020-09-08 |
| 10763166 |
Self-forming barrier for use in air gap formation |
Benjamin D. Briggs, Elbert E. Huang, Takeshi Nogami |
2020-09-01 |
| 10763160 |
Semiconductor device with selective insulator for improved capacitance |
Benjamin D. Briggs, Michael Rizzolo, Lawrence A. Clevenger, Huai Huang, Hosadurga Shobha |
2020-09-01 |
| 10679934 |
Capacitance reduction in sea of lines BEOL metallization |
Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Michael Rizzolo, Hosadurga Shobha |
2020-06-09 |
| 10658154 |
System and method for performing nano beam diffraction analysis |
Marc A. Bergendahl, James J. Demarest, Roger QUON, Christopher J. Waskiewicz |
2020-05-19 |
| 10651078 |
Selective ILD deposition for fully aligned via with airgap |
Benjamin D. Briggs, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2020-05-12 |
| 10629478 |
Dual-damascene formation with dielectric spacer and thin liner |
Benjamin D. Briggs, Lawrence A. Clevenger, Huai Huang, Michael Rizzolo, Hosadurga Shobha |
2020-04-21 |
| 10629428 |
Metal insulator metal capacitor devices |
Shariq Siddiqui, Han You, Xunyuan Zhang, Rohit Galatage, Roger QUON |
2020-04-21 |
| 10629529 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2020-04-21 |
| 10606231 |
Computer-mediated reality including physical damping feedback |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins |
2020-03-31 |
| 10566414 |
BEOL capacitor through airgap metallization |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2020-02-18 |
| 10566231 |
Interconnect formation with chamferless via, and related interconnect |
Martin O'Toole, Jae-ouk Choo, Adam L. da Silva, Craig Child, Terry A. Spooner +3 more |
2020-02-18 |
| 10546813 |
BEOL vertical fuse formed over air gap |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2020-01-28 |
| 10546774 |
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2020-01-28 |
| 10545806 |
Proximity correction in three-dimensional manufacturing |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Aldis Sipolins |
2020-01-28 |
| 10541206 |
Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo |
2020-01-21 |
| 10529569 |
Self aligned pattern formation post spacer etchback in tight pitch configurations |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +2 more |
2020-01-07 |
| 10529662 |
Method and structure to construct cylindrical interconnects to reduce resistance |
Benjamin D. Briggs, Michael Rizzolo, Huai Huang, Lawrence A. Clevenger, Hosadurga Shobha |
2020-01-07 |
| 10528817 |
Smart display apparatus and control system |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz, Jean Wynne, Jonathan Fry |
2020-01-07 |
