Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643891 | Via structures and via patterning using oblique angle deposition processes | Qanit Takmeel, Somnath Ghosh, Anbu Selvam K M Mahalingam, Sunil Kumar Singh | 2020-05-05 |
| 10566231 | Interconnect formation with chamferless via, and related interconnect | Martin O'Toole, Christopher J. Penny, Jae-ouk Choo, Adam L. da Silva, Terry A. Spooner +3 more | 2020-02-18 |