Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833010 | Integration of artificial intelligence devices | Lawrence A. Clevenger, Fee Li Lie, Effendi Leobandung | 2020-11-10 |
| 10825726 | Metal spacer self aligned multi-patterning integration | James J. Kelly, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-11-03 |
| 10818494 | Metal on metal multiple patterning | Ravi Prakash Srivastava, Somnath Ghosh, Nicholas V. LiCausi, Terry A. Spooner, Sean Reidy | 2020-10-27 |
| 10811310 | Metal spacer self aligned double patterning with airgap integration | James J. Kelly, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-10-20 |
| 10784119 | Multiple patterning with lithographically-defined cuts | Ravi Prakash Srivastava, Steven McDermott, Martin O'Toole, Brendan O'Brien, Terry A. Spooner | 2020-09-22 |
| 10741439 | Merge mandrel features | Martin O'Toole, Terry A. Spooner, Jason E. Stephens | 2020-08-11 |
| 10741751 | Fully aligned semiconductor device with a skip-level via | Nicholas Anthony Lanzillo, Benjamin D. Briggs, Chih-Chao Yang, Lawrence A. Clevenger | 2020-08-11 |
| 10714389 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | James J. Kelly, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-07-14 |
| 10651046 | Multiple patterning with late lithographically-defined mandrel cuts | Brendan O'Brien, Martin O'Toole, Keith Donegan | 2020-05-12 |
| 10615027 | Stack viabar structures | Su Chen Fan, Yann Mignot, James J. Kelly, Terence B. Hook | 2020-04-07 |
| 10573520 | Multiple patterning scheme integration with planarized cut patterning | Yongan Xu, Lawrence A. Clevenger, Yann Mignot, Cornelius Brown Peethala | 2020-02-25 |
| 10566231 | Interconnect formation with chamferless via, and related interconnect | Martin O'Toole, Christopher J. Penny, Jae-ouk Choo, Adam L. da Silva, Craig Child +3 more | 2020-02-18 |
| 10553789 | Fully aligned semiconductor device with a skip-level via | Nicholas Anthony Lanzillo, Benjamin D. Briggs, Chih-Chao Yang, Lawrence A. Clevenger | 2020-02-04 |
| 10546743 | Advanced interconnect with air gap | John H. Zhang, Yann Mignot, Lawrence A. Clevenger, Carl Radens, Richard S. Wise +2 more | 2020-01-28 |