Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833022 | Structure and method to improve overlay performance in semiconductor devices | Cung D. Tran, Huaxiang Li, Bradley Morgenfeld, Xintuo Dai, Sanggil Bae +7 more | 2020-11-10 |
| 10818494 | Metal on metal multiple patterning | Hsueh-Chung Chen, Somnath Ghosh, Nicholas V. LiCausi, Terry A. Spooner, Sean Reidy | 2020-10-27 |
| 10818557 | Integrated circuit structure to reduce soft-fail incidence and method of forming same | Sipeng Gu, Akshey Sehgal, Xinyuan Dou, Sunil Kumar Singh, Haiting Wang +1 more | 2020-10-27 |
| 10784119 | Multiple patterning with lithographically-defined cuts | Hsueh-Chung Chen, Steven McDermott, Martin O'Toole, Brendan O'Brien, Terry A. Spooner | 2020-09-22 |
| 10770344 | Chamferless interconnect vias of semiconductor devices | Yuping Ren, Haigou Huang, Zhiguo Sun, Qiang Fang, Cheng Xu +1 more | 2020-09-08 |
| 10714380 | Method of forming smooth sidewall structures using spacer materials | Sipeng Gu, Sunil Kumar Singh, Xinyuan Dou, Akshey Sehgal, Zhiguo Sun | 2020-07-14 |
| 10692812 | Interconnects with variable space mandrel cuts formed by block patterning | Hui Zang, Jiehui Shu | 2020-06-23 |