Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818557 | Integrated circuit structure to reduce soft-fail incidence and method of forming same | Sipeng Gu, Xinyuan Dou, Sunil Kumar Singh, Ravi Prakash Srivastava, Haiting Wang +1 more | 2020-10-27 |
| 10714380 | Method of forming smooth sidewall structures using spacer materials | Ravi Prakash Srivastava, Sipeng Gu, Sunil Kumar Singh, Xinyuan Dou, Zhiguo Sun | 2020-07-14 |