Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818557 | Integrated circuit structure to reduce soft-fail incidence and method of forming same | Sipeng Gu, Akshey Sehgal, Sunil Kumar Singh, Ravi Prakash Srivastava, Haiting Wang +1 more | 2020-10-27 |
| 10714380 | Method of forming smooth sidewall structures using spacer materials | Ravi Prakash Srivastava, Sipeng Gu, Sunil Kumar Singh, Akshey Sehgal, Zhiguo Sun | 2020-07-14 |
| 10643900 | Method to reduce FinFET short channel gate height | Hong Yu, Zhenyu Hu, Xing Zhang | 2020-05-05 |
| 10580857 | Method to form high performance fin profile for 12LP and above | Yanzhen Wang, Hongliang Shen, Sipeng Gu | 2020-03-03 |