Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770344 | Chamferless interconnect vias of semiconductor devices | Yuping Ren, Haigou Huang, Ravi Prakash Srivastava, Qiang Fang, Cheng Xu +1 more | 2020-09-08 |
| 10714380 | Method of forming smooth sidewall structures using spacer materials | Ravi Prakash Srivastava, Sipeng Gu, Sunil Kumar Singh, Xinyuan Dou, Akshey Sehgal | 2020-07-14 |