Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804188 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Chong Zhang, Junnan Zhao | 2020-10-13 |
| 10790159 | Semiconductor package substrate with through-hole magnetic core inductor using conductive paste | Chong Zhang, Yikang Deng, Junnan Zhao, Ying Wang | 2020-09-29 |
| 10777514 | Techniques for an inductor at a second level interface | Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2020-09-15 |
| 10770344 | Chamferless interconnect vias of semiconductor devices | Yuping Ren, Haigou Huang, Ravi Prakash Srivastava, Zhiguo Sun, Qiang Fang +1 more | 2020-09-08 |
| 10745816 | Transfer of vertically aligned ultra-high density nanowires onto flexible substrates | Kirk Jeremy Ziegler, Jie Liu | 2020-08-18 |
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Siddharth K. Alur, Liwei Cheng, Lauren A. Link, Jonathan L. Rosch +1 more | 2020-08-11 |
| 10643994 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2020-05-05 |