Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Siddharth K. Alur, Liwei Cheng, Jonathan L. Rosch, Sai Vadlamani +1 more | 2020-08-11 |
| 10700021 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani | 2020-06-30 |