Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700021 | Coreless organic packages with embedded die and magnetic inductor structures | Rahul Jain, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2020-06-30 |
| 10692965 | 3D conductive ink printing method and inductor formed thereof | Chong Zhang, Sheng Li, Sai Vadlamani, Ying Wang | 2020-06-23 |
| 10672859 | Embedded magnetic inductor | Rahul Jain, Sheng Li, Sai Vadlamani, Chong Zhang | 2020-06-02 |