Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Siddharth K. Alur, Liwei Cheng, Lauren A. Link, Jonathan L. Rosch, Sai Vadlamani +1 more | 2020-08-11 |
| 10734358 | Multi-packaging for single-socketing | Jonathan L. Rosch, Arun Chandrasekhar, Shawna M. Liff | 2020-08-04 |
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2020-07-07 |
| 10624213 | Asymmetric electronic substrate and method of manufacture | Sri Chaitra Jyotsna Chavali, Wei-Lun Kane Jen, Sriram Srinivasan | 2020-04-14 |