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Microelectronic bond pads having integrated spring structures |
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Robert Starkston, Scott M. Mokler, Richard C. Stamey |
2020-09-01 |
| 10716214 |
Hybrid microelectronic substrate and methods for fabricating the same |
Robert Starkston, Richard C. Stamey, Scott M. Mokler |
2020-07-14 |
| 10707168 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama |
2020-07-07 |
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Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley D. Mc Cullough |
2020-06-16 |
| 10658279 |
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Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu |
2020-05-19 |
| 10651116 |
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Sanka Ganesan |
2020-05-12 |
| 10651051 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
John S. Guzek |
2020-05-12 |
| 10634594 |
Membrane test for mechanical testing of stretchable electronics |
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Batsegaw K. Gebrehiwot, Joseph B. Petrini, Nicholas S. Haehn, Shankar Devasenathipathy, Alfredo Cardona |
2020-03-03 |
| 10535595 |
Conductive base embedded interconnect |
Adel A. Elsherbini |
2020-01-14 |