Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811366 | Microelectronic bond pads having integrated spring structures | Feras Eid, Sandeep B. Sane | 2020-10-20 |
| 10763215 | Hybrid microelectronic substrate and methods for fabricating the same | Robert Starkston, Scott M. Mokler, Richard C. Stamey | 2020-09-01 |
| 10716214 | Hybrid microelectronic substrate and methods for fabricating the same | Robert Starkston, Richard C. Stamey, Scott M. Mokler | 2020-07-14 |
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama | 2020-07-07 |
| 10700051 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2020-06-30 |
| 10685947 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley D. Mc Cullough | 2020-06-16 |
| 10658279 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu | 2020-05-19 |
| 10651116 | Planar integrated circuit package interconnects | Sanka Ganesan | 2020-05-12 |
| 10651051 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2020-05-12 |
| 10634594 | Membrane test for mechanical testing of stretchable electronics | Ravindranth V. Mahajan, Rajendra C. Dias, Pramod Malatkar, Steven A. Klein, Vijay Subramania +1 more | 2020-04-28 |
| 10576590 | Torque controlled driver apparatus and method | Batsegaw K. Gebrehiwot, Joseph B. Petrini, Nicholas S. Haehn, Shankar Devasenathipathy, Alfredo Cardona | 2020-03-03 |
| 10535595 | Conductive base embedded interconnect | Adel A. Elsherbini | 2020-01-14 |