Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Yu Zhang +7 more | 2020-09-22 |
| 10685947 | Distributed semiconductor die and package architecture | Mark Bohr, Rajesh Kumar, Robert L. Sankman, Ravindranath V. Mahajan, Wesley D. Mc Cullough | 2020-06-16 |