| 10867926 |
High density interconnect structures configured for manufacturing and performance |
Henning Braunisch, Kemal Aygun, Ajay Jain |
2020-12-15 |
| 10854539 |
Ground via clustering for crosstalk mitigation |
Kemal Aygun, Yu Zhang |
2020-12-01 |
| 10845552 |
Coreless package architecture for multi-chip opto-electronics |
Shawna M. Liff, Henning Braunisch, Timothy A. Gosselin, Prasanna Raghavan, Yikang Deng |
2020-11-24 |
| 10840196 |
Trace modulations in connectors for integrated-circuit packages |
Cemil Geyik |
2020-11-17 |
| 10833020 |
High density interconnect structures configured for manufacturing and performance |
Henning Braunisch, Kemal Aygun, Ajay Jain |
2020-11-10 |
| 10784204 |
Rlink—die to die channel interconnect configurations to improve signaling |
Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Wilfred Gomes, Yu Zhang +7 more |
2020-09-22 |
| 10748842 |
Package substrates with magnetic build-up layers |
Kaladhar Radhakrishnan, Kemal Aygun |
2020-08-18 |
| 10746780 |
High power terahertz impulse for fault isolation |
Mayue Xie, Simranjit S. Khalsa, Hemachandar Tanukonda Devarajulu, Deepak Goyal |
2020-08-18 |
| 10692847 |
Inorganic interposer for multi-chip packaging |
Daniel N. Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee +1 more |
2020-06-23 |
| 10658279 |
High density package interconnects |
Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu |
2020-05-19 |
| 10607951 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices |
Yu Zhang, Gabriel Regalado Silva, Kemal Aygun |
2020-03-31 |
| 10580734 |
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices |
Yu Zhang, Gabriel Regalado Silva, Kemal Aygun |
2020-03-03 |