Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692847 | Inorganic interposer for multi-chip packaging | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kyu Oh Lee, Kemal Aygun +1 more | 2020-06-23 |
| 10658307 | Control of warpage using ABF GC cavity for embedded die package | Digvijay A. Rorane, Ian En Yoon Chin | 2020-05-19 |