Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777514 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2020-09-15 |
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Merve Celikkol, Kemal Aygun +1 more | 2020-06-23 |
| 10643994 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Ji-Yong Park, Sai Vadlamani +1 more | 2020-05-05 |