Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2020-12-22 |
| 10856424 | Electronic assembly that includes void free holes | Sri Ranga Sai Boyapati, Amanda E. Schuckman, Sashi S. Kandanur, Mark S. Hlad, Kristof Darmawikarta | 2020-12-01 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2020-12-01 |
| 10820437 | Flexible packaging for a wearable electronic device | Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne +4 more | 2020-10-27 |
| 10798817 | Method for making a flexible wearable circuit | Aleksandar Aleksov, Javier Soto Gonzalez, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda +4 more | 2020-10-06 |
| 10777428 | Via interconnects in substrate packages | Rahul N. Manepalli | 2020-09-15 |
| 10777514 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Ying Wang +3 more | 2020-09-15 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Rahul N. Manepalli, Robert Alan May | 2020-08-11 |
| 10727184 | Microelectronic device including non-homogeneous build-up dielectric | Siddharth K. Alur | 2020-07-28 |
| 10714434 | Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates | Kristof Darmawikarta, Aleksandar Aleksov | 2020-07-14 |
| 10707410 | Magnetoresistive stacks with an unpinned, fixed synthetic anti-ferromagnetic structure and methods of manufacturing thereof | Bengt J. Akerman, Renu Whig, Jason Janesky, Nicholas Rizzo, Jon Slaughter | 2020-07-07 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Kristof Darmawikarta, Rahul Jain, Sri Ranga Sai Boyapati, Maroun D. Moussallem +1 more | 2020-07-07 |
| 10672695 | Multi-layer molded substrate with graded CTE | Rahul N. Manepalli | 2020-06-02 |
| 10658281 | Integrated circuit substrate and method of making | Rahul N. Manepalli, Kousik Ganesan, Marcel Wall | 2020-05-19 |