Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10856424 | Electronic assembly that includes void free holes | Sri Ranga Sai Boyapati, Sashi S. Kandanur, Srinivas V. Pietambaram, Mark S. Hlad, Kristof Darmawikarta | 2020-12-01 |
| 10685850 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2020-06-16 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amruthavalli P. Alur, Islam A. Salama, Yikang Deng +1 more | 2020-02-04 |