Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10856424 | Electronic assembly that includes void free holes | Sri Ranga Sai Boyapati, Amanda E. Schuckman, Sashi S. Kandanur, Srinivas V. Pietambaram, Kristof Darmawikarta | 2020-12-01 |
| 10734282 | Substrate conductor structure and method | Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow | 2020-08-04 |