Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734282 | Substrate conductor structure and method | Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad | 2020-08-04 |
| 10672713 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2020-06-02 |
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li | 2020-04-21 |