Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen | 2020-04-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen | 2020-04-21 |