Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847467 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Debendra Mallik, Jianyong Xie | 2020-11-24 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10734282 | Substrate conductor structure and method | Harold Ryan Chase, Mihir K. Roy, Mark S. Hlad | 2020-08-04 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2020-05-12 |