AE

Adel A. Elsherbini

IN Intel: 27 patents #30 of 5,492Top 1%
Overall (2020): #1,135 of 565,922Top 1%
27
Patents 2020

Issued Patents 2020

Showing 25 most recent of 27 patents

Patent #TitleCo-InventorsDate
10868366 Package architecture for antenna arrays Shawna M. Liff, William J. Lambert 2020-12-15
10854548 Inter-die passive interconnects approaching monolithic performance Zuoguo Wu, Debendra Das Sharma, Gerald Pasdast 2020-12-01
10852495 Microelectronic package communication using radio interfaces connected through wiring Shawna M. Liff, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla 2020-12-01
10847705 Reducing crosstalk from flux bias lines in qubit devices Lester Lampert, James S. Clarke, Jeanette M. Roberts, Ravi Pillarisetty, David J. Michalak +6 more 2020-11-24
10840430 Piezoelectric package-integrated sensing devices Feras Eid, Sasha N. Oster, Georgios Dogiamis, Shawna M. Liff, Thomas L. Sounart +1 more 2020-11-17
10803396 Quantum circuit assemblies with Josephson junctions utilizing resistive switching materials Zachary R. Yoscovits, Roman Caudillo, Ravi Pillarisetty, Hubert C. George, Lester Lampert +5 more 2020-10-13
10804227 Semiconductor packages with antennas Telesphor Kamgaing, Sasha N. Oster 2020-10-13
10756202 Quantum dot device packages Jeanette M. Roberts, Ravi Pillarisetty, David J. Michalak, Zachary R. Yoscovits, James S. Clarke 2020-08-25
10756004 Quantum computing assemblies with through-hole dies Javier A. Falcon, David J. Michalak 2020-08-25
10734735 Distributed on-package millimeter-wave radio Telesphor Kamgaing 2020-08-04
10734236 Electronic devices with components formed by late binding using self-assembled monolayers Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan 2020-08-04
10727185 Multi-chip package with high density interconnects Aleksandar Aleksov, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati 2020-07-28
10721568 Piezoelectric package-integrated acoustic transducer devices Georgios Dogiamis, Feras Eid, Johanna M. Swan, Shawna M. Liff, Thomas L. Sounart +1 more 2020-07-21
10686007 Quantum circuit assemblies with at least partially buried transmission lines and capacitors Hubert C. George, Lester Lampert, James S. Clarke, Ravi Pillarisetty, Zachary R. Yoscovits +5 more 2020-06-16
10672701 Thin electronic package elements using laser spallation Vivek Raghunathan, Yonggang Li, Aleksandar Aleksov, Johanna M. Swan 2020-06-02
10658566 Piezoelectric driven switches integrated in organic, flexible displays Shawna M. Liff, Feras Eid, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen +3 more 2020-05-19
10658312 Embedded millimeter-wave phased array module Telesphor Kamgaing, Valluri Rao 2020-05-19
10651525 Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more 2020-05-12
10644616 Piezoelectric package-integrated motor Shawna M. Liff, Georgios Dogiamis, Sasha N. Oster, Feras Eid, Thomas L. Sounart +1 more 2020-05-05
10634566 Piezoelectric package-integrated temperature sensing devices Feras Eid, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart, Shawna M. Liff +1 more 2020-04-28
10636716 Through-mold structures Sasha N. Oster, Srikant Nekkanty, Joshua D. Heppner, Yoshihiro Tomita, Debendra Mallik +2 more 2020-04-28
10594029 Actuatable and adaptable metamaterials integrated in package Shawna M. Liff, Sasha N. Oster, Feras Eid, Georgios Dogiamis, Thomas L. Sounart +1 more 2020-03-17
10595409 Electro-magnetic interference (EMI) shielding techniques and configurations Ravindranath V. Mahajan, John S. Guzek, Nitin A. Deshpande 2020-03-17
10594294 Piezoelectric package-integrated delay lines Feras Eid, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair, Georgios Dogiamis +2 more 2020-03-17
10593636 Platform with thermally stable wireless interconnects Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Brandon M. Rawlings, Feras Eid 2020-03-17