Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867961 | Single layer low cost wafer level packaging for SFF SiP | Chuan Hu | 2020-12-15 |
| 10629551 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita | 2020-04-21 |
| 10594294 | Piezoelectric package-integrated delay lines | Adel A. Elsherbini, Feras Eid, Baris Bicen, Telesphor Kamgaing, Georgios Dogiamis +2 more | 2020-03-17 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita +1 more | 2020-02-25 |
| 10546835 | Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing | 2020-01-28 |
| 10535634 | Multi-layer package | Chuan Hu, Thorsten Meyer | 2020-01-14 |