Eric J. Li — 6 Patents at Intel

Issued Patents 2020

Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10790231	Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate	Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas	2020-09-29	$31,444,000
10707171	Ultra small molded module integrated with die by module-on-wafer assembly	Tomita YOSHIHIRO, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner	2020-07-07	$29,601,000
10672626	Method and materials for warpage thermal and interconnect solutions	Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar	2020-06-02	$32,838,000
10615128	Systems and methods for electromagnetic interference shielding	Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Nachiket R. Raravikar	2020-04-07	$35,530,000
10573608	Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package	Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more	2020-02-25	$18,813,000
10541190	Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material	Chandra Mohan Jha	2020-01-21	$31,546,000