Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790231 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2020-09-29 |
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Tomita YOSHIHIRO, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2020-07-07 |
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar | 2020-06-02 |
| 10615128 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Nachiket R. Raravikar | 2020-04-07 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more | 2020-02-25 |
| 10541190 | Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material | Chandra Mohan Jha | 2020-01-21 |