Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Henning Braunisch, Prasanna Raghavan, Yikang Deng, Zhiguo Qian | 2020-11-24 |
| 10790231 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Yoshihiro Tomita, Shawna M. Liff, Amram Eitan, Mark Saltas | 2020-09-29 |