Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867926 | High density interconnect structures configured for manufacturing and performance | Kemal Aygun, Ajay Jain, Zhiguo Qian | 2020-12-15 |
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Timothy A. Gosselin, Prasanna Raghavan, Yikang Deng, Zhiguo Qian | 2020-11-24 |
| 10845380 | Microelectronic devices for isolating drive and sense signals of sensing devices | Feras Eid, Georgios Dogiamis, Sasha N. Oster | 2020-11-24 |
| 10833020 | High density interconnect structures configured for manufacturing and performance | Kemal Aygun, Ajay Jain, Zhiguo Qian | 2020-11-10 |
| 10819445 | Waveguide and transceiver interference mitigation | Telesphor Kamgaing, Georgios Dogiamis, Hyung-Jin Lee, Richard J. Dischler | 2020-10-27 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2020-09-01 |
| 10734236 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan | 2020-08-04 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2020-05-12 |
| 10645813 | Zero-misalignment via-pad structures | Brandon M. Rawlings | 2020-05-05 |
| 10623106 | Orthogonal frequency division multiplexing single sideband transmission over a waveguide | Hyung-Jin Lee, Cho-Ying Lu, Telesphor Kamgaing, Georgios Dogiamis, Richard J. Dischler | 2020-04-14 |