| 10867926 |
High density interconnect structures configured for manufacturing and performance |
Kemal Aygun, Ajay Jain, Zhiguo Qian |
2020-12-15 |
| 10845552 |
Coreless package architecture for multi-chip opto-electronics |
Shawna M. Liff, Timothy A. Gosselin, Prasanna Raghavan, Yikang Deng, Zhiguo Qian |
2020-11-24 |
| 10845380 |
Microelectronic devices for isolating drive and sense signals of sensing devices |
Feras Eid, Georgios Dogiamis, Sasha N. Oster |
2020-11-24 |
| 10833020 |
High density interconnect structures configured for manufacturing and performance |
Kemal Aygun, Ajay Jain, Zhiguo Qian |
2020-11-10 |
| 10819445 |
Waveguide and transceiver interference mitigation |
Telesphor Kamgaing, Georgios Dogiamis, Hyung-Jin Lee, Richard J. Dischler |
2020-10-27 |
| 10763216 |
Multi-chip package and method of providing die-to-die interconnects in same |
Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2020-09-01 |
| 10734236 |
Electronic devices with components formed by late binding using self-assembled monolayers |
Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan |
2020-08-04 |
| 10651525 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2020-05-12 |
| 10645813 |
Zero-misalignment via-pad structures |
Brandon M. Rawlings |
2020-05-05 |
| 10623106 |
Orthogonal frequency division multiplexing single sideband transmission over a waveguide |
Hyung-Jin Lee, Cho-Ying Lu, Telesphor Kamgaing, Georgios Dogiamis, Richard J. Dischler |
2020-04-14 |