Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861815 | High density substrate routing in package | Weng Hong Teh | 2020-12-08 |
| 10796988 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2020-10-06 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2020-09-01 |