| 10872872 |
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more |
2020-12-22 |
| 10820437 |
Flexible packaging for a wearable electronic device |
Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne, Albert S. Lopez +4 more |
2020-10-27 |
| 10816733 |
Piezoelectrically actuated mirrors for optical communications |
Sasha N. Oster, Johanna M. Swan, Feras Eid, Thomas L. Sounart, Shawna M. Liff +2 more |
2020-10-27 |
| 10798817 |
Method for making a flexible wearable circuit |
Javier Soto Gonzalez, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda, Sashi S. Kandanur +4 more |
2020-10-06 |
| 10763216 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2020-09-01 |
| 10741534 |
Multi-die microelectronic device with integral heat spreader |
Sri Ranga Sai Boyapati, Kristof Darmawikarta, Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram |
2020-08-11 |
| 10727185 |
Multi-chip package with high density interconnects |
Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati |
2020-07-28 |
| 10714434 |
Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates |
Srinivas V. Pietambaram, Kristof Darmawikarta |
2020-07-14 |
| 10685949 |
Flexible electronic system with wire bonds |
Mauro J. Kobrinsky, Johanna M. Swan, Rajendra C. Dias |
2020-06-16 |
| 10672701 |
Thin electronic package elements using laser spallation |
Vivek Raghunathan, Yonggang Li, Adel A. Elsherbini, Johanna M. Swan |
2020-06-02 |
| 10658566 |
Piezoelectric driven switches integrated in organic, flexible displays |
Shawna M. Liff, Feras Eid, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +3 more |
2020-05-19 |
| 10651525 |
Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2020-05-12 |
| 10649158 |
Alignment of single and multi-mode optical fibers using piezoelectric actuators |
Johanna M. Swan, Sasha N. Oster, Feras Eid, Baris Bicen, Thomas L. Sounart +2 more |
2020-05-12 |
| 10634594 |
Membrane test for mechanical testing of stretchable electronics |
Ravindranth V. Mahajan, Rajendra C. Dias, Pramod Malatkar, Steven A. Klein, Vijay Subramania +1 more |
2020-04-28 |
| 10566672 |
Waveguide connector with tapered slot launcher |
Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more |
2020-02-18 |