Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2020-12-22 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2020-12-01 |
| 10790233 | Package substrates with integral devices | Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2020-09-29 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Rahul N. Manepalli, Srinivas V. Pietambaram | 2020-08-11 |
| 10727185 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2020-07-28 |
| 10705293 | Substrate integrated waveguide | Kristof Darmawikarta, Rahul Jain, Sri Ranga Sai Boyapati, Maroun D. Moussallem, Rahul N. Manepalli +1 more | 2020-07-07 |
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Islam A. Salama, Robert L. Sankman | 2020-07-07 |